Simulation
Crucial Role of Simulation on Technical Advancements
Simulation technology plays a vital role in predicting and analyzing product performance. Nextron focused on four key areas: high frequency, thermal, mechanical, and mold flow. Each of these areas is closely related to our connectivity solutions and other products.
- 1. High-Frequency:
Reliable and efficient operation of electronics in high-speed applications is critical, especially in telecom and networking. Nextron's technology assesses signal transmission efficiency, strength reduction, reflected signals, crosstalk, and mode conversion. EMC ensures compliance with regulatory standards and compatibility in electromagnetic environments. Collectively, these simulations guarantee the performance of electronic components under high-frequency conditions.
Nextron's unique equipment captures the characteristics of materials, improving simulation accuracy and speeding up development. This is crucial for meeting the high-speed requirements of telecom and networking electronics.
- 2. Thermal:
Thermal simulation is to ensure reliability and efficiency. At Nextron, thermal simulation ensures that our high-power electronic systems are thermally efficient. Our simulations evaluate heat management, analyzing the heat dissipation capabilities of devices, components, and sub-assemblies to prevent overheating. We also consider temperature rise due to electrical current, airflow dynamics, fluid behavior, heat generated in welding processes, and fan noise balancing for cooling efficiency, ensuring our products meet all safety standards.
Most importantly, our thermal simulations are designed to model the entire system, not just individual components.
- 3. Mechanical Simulation:
Nextron conducts mechanical simulations to evaluate how materials and structures react to mechanical forces and pressure. This ensures the durability of products in environments prone to physical stress and vibration. The simulation includes an in-depth analysis of deformation, insertion and retention force, direct pressure, and resonance phenomena. It also covers vibration study, impact resistance, and waterproofing effectiveness, ensuring our products are durable and reliable in various load conditions.
By simulating stress, we can enhance the locking design of connectors to ensure they maintain optimal user experience while achieving targeted strength.
- 4. Mold Flow:
Mold Flow simulation is a process that studies the flow of material and its solidification in plastic injection molding. It is used to predict and prevent defects, ensure consistency, and optimize design for manufacturability. The process covers various essential aspects such as cooling lines, multi-cavity molds, and thickness analysis. The simulation monitors pressure curves, fill times, weld lines, and temperatures to prevent defects. It also assesses shrinkage, voids, warping, sink marks, and clamping force. This helps us predict and prevent manufacturing defects, ensure consistency, and refine designs for better manufacturability.
Nextron specializes in plastic injection products, including engineering materials such as PSU and medical-grade materials like PIC. These materials have different injection characteristics compared to conventional materials, making them more challenging to handle for standard injection molding facilities. However, Nextron has extensive experience in Mold Flow simulation and process management. We understand the impact of plastic thickness on flow rate and the crystallization temperature differences of various materials, which allows us to control these aspects precisely.
Overall, Nextron utilizes simulation technologies to predict and analyze product performance under varied conditions, producing reliable, high-quality products.
