Communication Solutions
Nextron has been accumulating technology patents for more than 30 years, providing solutions for switches, communication equipment, and network cards through backplane connectors, high-speed I/O connectors, and communication sub-systems. Therefore, we can meet the needs of the 5G network or the high-speed data transmission triggered by AI effectively.
Nextron also provides thermal solutions for communication equipment from the component to the system level. Different from other providers, we have a deep understanding of the thermal challenges that switches and servers faced in limited space. Nextron offers a one-stop solution to meet your signal transmission, mechanical and thermal needs.
Telecommunication transmission is an essential infrastructure, carrying a large amount of information. Therefore, ensuring stability and reliability is the top priority for the equipment, and that’s one of the strengths of Nextron.
Nextron offers a complete solution from fronthaul to the core network. Starting by developing the backplane solutions, we have created a wide range of product lines including 1G~400G optical communication connectors, 5G mid-haul, and various types of chassis. Currently, Nextron's products have been adopted by three-quarters of the world's major telecom equipment giants.
Data Center plays a vital role in the enterprise. As the backbone of the digital world, its transmission speed requirement is increasing day by day. The transmission rates of the high-speed computing data centers have migrated from 100G and 200 G to 400 G. Along with the surging computing demand of AI machine learning, 800 G solutions will widely be adopted since 2023.
Nextron combines high-speed transmission and thermal solutions to meet the needs of high-speed computing. Expanding from the mass production of 400G solutions, we have invested in QSFP112-DD and developed different solutions including air cooling, water cooling, and ways to solve the problems in thermal engineering of 15 watts or even higher power consumption by multiple materials.
VLC and AI Switches: Unlocking New Levels of High-Speed Data Transmission for AI Clusters
AI clusters are driving a new era of high-speed data center connectivity. As GPU, AI ASIC, and switch performance continue to scale, efficient data movement has become just as critical as compute power. Vertical Line Card (VLC) architecture shortens the electrical path between ASICs and optical modules, improving signal integrity, reducing power consumption, and easing thermal challenges. It also enables higher I/O density and greater scalability for next-generation AI switches.
As AI infrastructure evolves toward 224G, 448G, and beyond, optical and copper interconnects will increasingly work together—optics for high-bandwidth, long-distance transmission, and copper for low-latency, short-reach connectivity. Leveraging expertise in connectors, high-speed cabling, thermal management, and mechanical integration, NEXTRON provides customized interconnect solutions that help accelerate the deployment of next-generation AI networking platforms.
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XPO msa: High-Speed I/O Interface for AI Servers
AI Infrastructure Is Entering an Era Defined by Server Density and Thermal Efficiency
As AI systems scale, the limitations of future infrastructure are increasingly shaped by physical constraints rather than compute performance alone.
Higher server density, thermal management, and high-speed connectivity are becoming the new foundations of AI infrastructure.
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Efficient Data Exchange: The Single-Pair Ethernet Solution
The emergence of Single-Pair Ethernet (SPE) has transformed data transmission and communication, offering remarkable advantages. SPE utilizes a single pair of twisted copper wires for both signaling and power transmission, delivering data speeds from 10Mbit/s up to 1 GBit/s. This represents a significant improvement over previous Ethernet standards, which required multiple pairs.
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Revolutionizing 5G with 400G Connectivity Solutions
The establishment of 5G has been driven by the growing number of devices requiring high speed data transmission/large bandwidth internet access/low-latency, including industries such as AIoT, edge-computing, broadband mobile service, VR/AR, autonomous vehicle's V2X and more.
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