Thermal
As we pursue higher data transmission rates and larger power transmission, heat dissipation is a significant topic that should be addressed along the way. In order to ensure the safety and reliability of our connection products, Nextron has been investing heavily in heat dissipation R&D abilities.
From component to system level, Nextron leverages excellent thermal simulation capabilities and delivers unique designs, machining, and system assembly services to provide our customers with the most efficient and safe thermal solution.
Component Level
Thermal Solutions for I/O Connectors
| Air Cooling Heat sinks and heat pipes are custom designed with space limitations and target temperature in consideration. Special mechanical design and material selection for excellent heat dissipation. |
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Liquid Cooling
Dissipating up to 20W/pole in different configurations.
Custom design available to configure with water channel within the chassis.
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Thermal Conductive Material and Additions
Thermal conductive materials, thermal pads/tapes, and thermal interface coatings are under development.
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Case :
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Air Cooling Solution for CPU
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Cold Plate for Sensor Box
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Compact System Level
Case :
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Air Cooling Solution for Compact Chassis
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Heat Dissipation Chassis for 5G Antenna
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Total System Level
Heat Dissipation Solution for Data Center
- Not just single components, appropriate components are selected based on system-level simulation to reach target temperature in compact space.
Simulation Capabilities
Thermal Analysis Tools
Software: Solid Works Flow Simulation 2020
Number of engineers: 2 (6 years experience)
Verification Equipment
Easy verification set: Ceramic heater and test chassis
Quality analysis center: Thermal cycle tester, humidity chamber
Case :
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Air Cooling Flow Simulation
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Liquid Cooling Flow Simulation
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